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Thermal conductivity of Indian unleavened flat bread (Chapati) at various stages of baking.

Gupta, T. R. (1993) Thermal conductivity of Indian unleavened flat bread (Chapati) at various stages of baking. Journal of Food Process Engineering, 16 (3). 227-235, 14 ref..

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Abstract

A steady state technique was used to measure thermal conductivity of whole wheat dough (for production of rolled chapatti) and baked chapatti (round disc prepared mostly from whole wheat flour dough) at various stages of cooking. Based on the experimental data of chapatti at various stages of cooking, a linear equation K = -0.5677 + 0.01396 M + 0.005131 T is proposed for conductivity of wheat flour dough and baked chapatti at moisture levels (M): 35 < M < 50% [wet basis] and temp. ranges 35 < T < 60

Item Type: Article
Uncontrolled Keywords: BAKERY-PRODUCTS; CEREAL-PRODUCTS; MATHEMATICS-; PHYSICAL-PROPERTIES; THERMOPHYSICAL-PROPERTIES; CHAPATTIS-; EQUATIONS-; THERMAL-CONDUCTIVITY
Subjects: 600 Technology > 08 Food technology > 14 Physical properties
600 Technology > 08 Food technology > 26 Bakery products
Divisions: Food Engineering
Depositing User: Food Sci. & Technol. Information Services
Date Deposited: 30 May 2016 07:15
Last Modified: 30 May 2016 07:15
URI: http://ir.cftri.com/id/eprint/7923

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