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Viscoelasticity of a simulated polymer and comparison with chickpea flour doughs.

Nidhi, Yadav and Roopa, B. S. and Suvendu, Bhattacharya (2006) Viscoelasticity of a simulated polymer and comparison with chickpea flour doughs. Journal of Food Process Engineering, 29 (3). pp. 234-252.

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Official URL: http://onlinelibrary.wiley.com/doi/10.1111/j.1745-...


Viscoelasticity of a simulated model system of poly(dimethyl siloxane), a viscoelastic polymer material, was investigated. In compression and stress relaxation tests, compressive strain, height of sample and crosshead speed were varied. Parameters derived were the forces at the end of compression and relaxation, energy for compression, and the extent of elasticity of the sample based on the ratios of forces, as well as the proposed energy values. Results were verified with food doughs undergoing large deformations that show a nonlinear behaviour. The proposed extent of elasticity, based on the ratios of energy stored and compression, was used as an index for the characterization of viscoelasticity. A nonlinear 3-parameter model was also used to predict the stress decay characteristics as a function of time, and was found to be better than the 2-parameter Peleg model, as judged by lower variance values (0.0006-0.018 and 0.002-0.048, respectively). Furthermore, an actual system consisting of chick pea meal dough was used to verify the proposed model and viscoelastic index at different moisture contents (27-39%) subjected to compressive strains of 25-75%. The nonlinear relaxation characteristics of the food dough were found to be sensitive to moisture content as well as to strain level.

Item Type: Article
Subjects: 600 Technology > 05 Chemical engineering > 04 Fermentation Technology
600 Technology > 08 Food technology > 14 Physical properties > 03 Rheology
600 Technology > 08 Food technology > 22 Legumes-Pulses
Divisions: Food Engineering
Depositing User: Users 16 not found.
Date Deposited: 28 Jun 2011 11:18
Last Modified: 12 Jun 2019 09:23
URI: http://ir.cftri.com/id/eprint/7508

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